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Manufacturing Process Development Engineer-Wafer Cleaving Operation

Lumentum
Posted 2 months ago, valid for a day
Location

Greensboro, NC 27402, US

Salary

Competitive

Contract type

Full Time

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Sonic Summary

info
  • We are looking for an experienced Process Engineer with 5+ years of industrial experience in semiconductor or advanced manufacturing processes.
  • The role involves leading the processing of singulation and facet preparation for edge emitting laser components.
  • Key responsibilities include sustaining existing processes, developing new technologies, and providing engineering support for thinning operations in high-volume manufacturing.
  • Candidates should have a B.S. or M.S. in Materials Science, Mechanical Engineering, Electrical Engineering, or a related discipline.
  • Salary details are not specified, but applicants should be prepared to demonstrate relevant experience and skills.

It's fun to work in a company where people truly BELIEVE in what they're doing!
We're committed to bringing passion and customer focus to the business.

If you like wild growth and working with happy, enthusiastic over-achievers, you'll enjoy your career with us!

Role Overview:

We are seeking a experienced Process Engineer to lead processing of singulation and facet preparation on edge emitting laser components through the back end of line.    This role will both sustain existing processes and develop processes for new technologies.

Key Responsibilities

Wafer singulation

  • Process development for wafer cleaving operation
  • Own and sustain processing of thinned wafers through the singulation and facet coating preparation
  • Establish and maintain processes, specifications, SPC controls, FMEAs and OCAPs

Facet Processing

  • Develop and sustain pick and place processes and equipment
  • Develop and sustain bar stacking/unstacking to and from fixtures for facet processing

Manufacturing Support & Yield Improvement

  • Provide real‑time engineering support for thinning operations in high‑volume manufacturing
  • Lead response to process excursions, tool issues, and product at‑risk situations using structured problem‑solving methods
  • Investigate yield losses, defects, and reliability issues and implement corrective and preventative actions
  • Utilize SPC, DOE, and statistical analysis tools to identify root causes and improvement opportunities

Required Qualifications

  • B.S. or M.S. in Materials Science, Mechanical Engineering, Electrical Engineering or related discipline
  • 5+ years of industrial experience supporting semiconductor or advanced manufacturing processes

Preferred Experience & Skills

  • Experience in semiconductor wafer fabrication
  • Experience with wafer die singulation
  • Experience with pick and place equipment and die handling practices
  • Familiarity with automation and advanced process control
  • Proficiency with JMP, Excel, SQL, Python, or similar data tools
  • Excellent written and verbal communication skills, including technical documentation

We are an equal opportunity employer and value diversity at our company.

We do not discriminate on the basis of race, religion, color, national origin, sex, gender, gender expression, sexual orientation, age, marital status, veteran status, or disability status.

We will ensure that individuals with disabilities are provided reasonable accommodation to participate in the job application or interview process, to perform essential job functions, and to receive other benefits and privileges of employment.

Please contact us to request accommodation.




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By applying, a Lumentum account will be created for you. Lumentum's Privacy Policy and Terms & Conditions will apply.

SonicJobs' Terms & Conditions and Privacy Policy also apply.